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MI Tech will complete Correction Wave then Fly Todamoon

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MYX:MI   MI TECHNOVATION BERHAD
Malaysia-based company engaged in the design, development and manufacturing of wafer-level chip scale packaging (WLCSP) sorting machines with testing capabilities. The Company’s products include WLCSP die sorting machine, wafer to wafer sorting machine, and WLCSP post sawn final test machine. It provides its products to the semiconductor industry. The Company also provides maintenance services, technical support and other after sales services.

Already operating two business divisions, namely, semiconductor equipment business unit (SEBU) and semiconductor material business unit (SMBU), the group plans to establish its third business unit, semiconductor manufacturing and specific process services, by 2024.

The fourth business unit, technology intensive commercial products, is expected to be ready by 2026.

The plan was spelled out by group CEO Oh Kuang Eng at a recent analysts’ briefing post results for the second quarter (Q2) ended June 30, 2021.

According to Public Invest Research, Mi Technovation has set its sight on acquisition deals of up to US$285mil (RM1.1bil).

Under the plan, the group is targeting up to US$240mil (RM1bil) worth of acquisitions in China, Taiwan and South Korea to expand the portfolio for SEBU.

In addition, the group has set aside US$35mil-US$45mil (RM145mil-RM185mil) to acquire two chemical companies in the European Union and United States, which have strong exposure to automotive industry and semiconductor high-end package that can complement its newly acquired solder ball business.
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