dlqmfk

TSM Breakout + Gap fill

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dlqmfk 已更新   
NYSE:TSM   Taiwan Semiconductor Manufacturing Company Ltd.
TSM has been consolidating under the 119 level (rejected 3 times). If daily closes above 119, potential break out and gap fill above to 121 then 124

Technicals:
- RSI over 50
-Price in uptrend
-Ascending triangle pattern
-9EMA crossed 21EMA (daily time frame)
-Decreasing volume inside triangle pattern
-Gap above (121 to 124)
-Price at volume shelf
评论:
Close over 119.50 needed for breakout confirmation
交易结束:到达目标:
First price target reached. Trade closed as market sentiment is not in favor of trade direction
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